NVIDIA CEO Jensen Huang traveled to China’s Taiwan last Friday for urgent talks with TSMC regarding 3-nanometer chip capacity. To meet soaring demand for NVIDIA’s Blackwell Ultra and next-generation Rubin AI chips, TSMC has decided to boost monthly 3nm production at its Fab 18B facility in the Southern Taiwan Science Park from 100,000 to 160,000 wafers — a 50% increase. More than 35,000 of these additional wafers will be dedicated exclusively to NVIDIA, helping the company achieve its shipment goal of 20 million AI chips over the next five quarters. [Icsmart, in Chinese]
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