At its recent North America Technology Symposium, TSMC said it is doubling the pace of advanced-node capacity expansion to meet booming demand for AI and high-performance computing (HPC). Senior Vice President Hou Yongqing said five 2nm fabs are set to enter ramp-up to mass production in 2026, marking the most aggressive expansion in the company’s history. The 2nm process entered mass production in the fourth quarter of 2025, with a yield learning curve outperforming its 3nm predecessor, according to the company.
Despite adopting a more complex nanosheet architecture, the company said it has rapidly improved manufacturing stability. The next-generation A16 node, featuring backside power delivery, is also progressing, aimed at meeting the rising performance and efficiency demands of AI and automotive applications. [Icsmart, in Chinese]
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