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TSMC begins production of Intel’s Lunar Lake processor, Core Ultra 200V series

TSMC aims to promote mass production of the second generation of 3nm chips (N3E process) in 2024.

Intel’s Lunar Lake processor, also known as the Core Ultra 200V series, is being fully manufactured by TSMC for the first time, with the computing module using TSMC’s 3nm process (N3B technology) and the platform control module using TSMC’s 6nm process (N6 technology), according to local media outlet MyDrivers. Intel will launch the Lunar Lake at the end of the third quarter, introducing the new Lion Cove P-core architecture, Skymont E-core architecture, and Xe2-LPG integrated graphics architecture for the first time. The Lunar Lake will also debut the integration of on-package memory (16/32GB). Another part of the Core Ultra 200 series, Arrow Lake, will target high-performance desktops and will enter the market in the fourth quarter. [MyDrivers, in Chinese]

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